Which NEC table is used to size the bonding jumper for an interconnected metal frame of a separately supplied building?

The bonding jumper for an interconnected metal frame of a separately supplied building is sized according to NEC Table 250.102(C)(1). This table provides the necessary information for determining the appropriate size of bonding jumpers used to connect noncurrent-carrying metal parts of equipment and systems, ensuring proper grounding and bonding to help mitigate electrical shock hazards and ensure system reliability.

Table 250.102(C)(1) specifically addresses the sizing of bonding jumpers for multi-building or separately supplied structures, distinguishing it from other tables that focus on different aspects of grounding and bonding. This is crucial when dealing with interconnected systems, as they may have varied grounding requirements depending on their configuration and supply conditions.

Tables like 250.102(B) or 250.122 serve different purposes, such as sizing equipment bonding conductors or grounding electrode conductors, while Table 250.92 deals with reduction methods for grounding and bonding conductors. Therefore, for interconnected metal frames in separately supplied buildings, the correct table for sizing the bonding jumper is indeed Table 250.102(C)(1).